MX2188 features long bath life and optimum performance from 120 to 160 ☏. The cleaner also has low, 102 g/L volatile organic compounds (VOCs) at 100% dilution, and is non-flammable, non-corrosive, recyclable, and multi-metal-safe. Micronox MX2188 low-chemical oxygen-demand (COD) aqueous precision cleaner is intended for use at low concentrations while cleaning tight-pitch and low-standoff devices. of America, Clinton, NY, ENVIRONMENTALLY FRIENDLY MATERIALS Aqueous Cleaner NF260 exceeds endurance expectations, with no failures in > 450 tests. Drop tests demonstrate an increased reliability gain, which includes an edge-weighted board to force difficult impact orientation. The XyflexPro + dispense system features a composite gantry design structure and linear drive system, is capable of dispensing at 45,000 dph, and maintains X-Y placement accuracy of 2,500 cycles with no failures and thermal shock testing prove durability. DEK International GmbH, Zurich, Switzerland, (also submitted for Wafer-level Packaging Equipment & Materials)ĭISPENSING/ENCAPSULATION/MOLDING/UNDERFILL EQUIPMENT & MATERIALS Dispense System Click here to enlarge image The system can also be configured for wafer bumping, DirEKt ball placement, thermal interface material (TIM) processing, and encapsulation. The pallet processes wafers as thin as 100 µm and up to 300 mm, and the squeegee uniformly applies adhesive paste to the backside of the wafer. Bondline thickness can be controlled to customer specifications, fillet control is consistent, units-per-hour (uph) is said to be higher than dispensing, and coated wafers can be pre-manufactured and stored until required. Newport Corp., North Billerica, MA, Wafer CoatingĭirEKt Coat consists of a micron-class, Galaxy mass imaging system, ultra-flat pallet, die-attach stencil or screen, and squeegee.
#DATACON 2200 EVO SETUP MANUAL FULL#
The MRSI-M5 incorporates CAD download, automatic program selection, full traceability, and network connectivity. The system’s fully automatic material handling conveyor operates in-line or cassette-to-cassette. A work area accommodates waffle packs, Gel-Paks, wafers, and feeders. The machine base is formed of a cast polymer composite engineered for thermal stability and vibration dampening properties. The MRSI-M5 5-µm work cell provides assembly solutions for epoxy die attach, eutectic, and flip chip bonding. Assembly Work Cell Click here to enlarge image The Electronics Group of Henkel, Irvine, CA,. It can be used on various surfaces, including solder resist, bare silicon, and multiple die passivations.
The material is a non-conductive, PTFE-filled paste that exhibits low resin bleed with fast cure capability. Qualified for use in lead-free environments and as an alternative to film die attach, its protective and low-bleed formulation can be used for both mother and daughter die.
Hysol QMI536NB claims to be a one-material solution for thin-stacked dies. Datacon Technology GmbH, Radfeld, Austria, Die-attach Material Click here to enlarge image A separate dispense unit with integrated camera system is claims to enable 25-µm accuracy at 3 sigma, and an optional second dispenser allows for independent epoxy applications. An automatic tool changer for up to 14 pick-and-place tools, and an eject carousel system for 5 eject tools, handles die sizes between 0.17 and 50 mm. An automatic flip chip bonding unit features a flux-dipping option and optional heated bond head. The 2200 evo handles up to 25 300-mm wafers on less than 1.5 sq m., performing up to 7,000 uph with a >99.95% yield for die-attach applications. Surface Technology Systems plc, Newport, Wales, DIE ATTACH EQUIPMENT & MATERIALS Die Bonder Click here to enlarge image A deep reactive ion etching (DRIE) advanced silicon etch (ASE) process enables vias with near-vertical sidewalls to provide electrical connections between stacked devices. The system is fully compatible with any of STS’ modular platform configurations.
#DATACON 2200 EVO SETUP MANUAL SOFTWARE#
Included software and hardware features provide reduced feature roughness and improved profile control, while maintaining high etch rates. The Pegasus process module incorporates a high-uniformity plasma source design, proprietary parameter ramping, and silicon-on-insulator (SOI) technologies. Florian, Austria, Plasma Etch Click here to enlarge image Form factor reduction is achieved by stacking multiple chips. High-precision, wafer-to-wafer alignment allows actual chip-size packaging, as the gasket width can be reduced in size. Due to the automated in-situ calibration mechanism, accuracy is maintained in high-volume manufacturing with minimal maintenance. The SmartView wafer alignment system is said to eliminate the need for secondary process steps and material requirements.